Our RPC-10 Removes Surface Contaminants Without Melting the Base Material!
A clean metal surface is critical to providing high quality welds. Caustic chemicals and mechanical cleaning can degrade the material and are environmentally unfriendly.

The RPC-10 cleans by using a low amp reverse polarity current to remove surface contaminants without melting the base material.

Why Plasma Clean?
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Plasma treating a surface to be bonded improves adhesion
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Plasma cleaning replaces chemical etching leaving no organic films and eliminating chemical cleanup
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Mechanical abrading techniques such as sand blasting can be abandoned as well

Contaminant Removal & Oxide Reduction:
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The chemical species from the plasma reacts with the surface contaminant species to form volatile reaction products. The products are then carried away by the excess shielding gas.
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Since oxides have a high electron emissivity the plasma concentrates on these areas and effectively reduces the oxide layer almost entirely. The resulting surface has the appearance of being scoured. This is normally the case with an Argon plasma. The resulting surface has a dull or non-reflective appearance.
For More Information Call 615-793-7020 or Contact Us
 
 
 
Continuous Cleaning: Continuous cleaning involves a technique of applying the high frequency energy to the work piece at a constant rate until all cleaning is accomplished. The electrode is moved over the surface of the material until all oxides or contaminants are removed.
Burst Cleaning: Burst cleaning allows for more aggressive surface cleaning with minimal heat transferred into the work piece. This technique involves activating and de-activating the switch several times through the process. The RPC10 is designed so that repeated cleaning action can be initiated immediately as long as the postflow time has not elapsed. Therefore, an operator can pulse the high frequency on and off in real time.		 Burst cleaning is most effective when used on small components that cannot tolerate a lot of heat input, but have a significant amount of surface contaminant or oxide. For example, continuous cleaning at 4.00 amps on a small component may actually melt the material. However, it can be burst cleaned at this setting without damaging the component.

There are other variables besides current that will effect the cleaning process. The area cleaned will be proportional to the gas cup orifice size. Therefore, changing gas cups can control the area being cleaned. Also, more aggressive cleaning action can be accomplished by increasing the gas flow rate. Finally, gas composition can be changed to influence the cleaning. Normally, argon is used. Introducing a small amount of hydrogen into the argon will make the cleaning more aggressive as well.
Process Welding Systems, Inc. • 72 Buchanan St • LaVergne, TN 37086 • Ph: 615-793-7020 • Fx: 615-793-7557